Description
Diamond pads are suitable for grinding substrates of semiconductors, electronic devices and power semiconductors such as SiC wafers (silicon carbide), GaN(gallium nitride) and Ga203 wafers (gallium oxide). It can be used in the grinding process of metal substrate, quartz substrate, ceramic substrate and glass substrate. They can grind hard-to-cut and fragile materials with faster grinding speeds, less damage, less surface roughness and a flatter surface finish
Applications: Substrates for semiconductors, electronic devices and power semiconductors such as SiC wafers (silicon carbide), GaN(gallium nitride) and Ga203 wafers (gallium oxide). It can be used in the grinding process of metal substrate, quartz substrate, ceramic substrate and glass substrate.
Features: Improve the grinding speed, can shorten the subsequent polishing time, has a high grinding cutting force, cutting stability and long service life, high processing efficiency, can improve productivity
Specifications: 3-100 micron grinding pads of any shape can be customized on demand
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